计算机应用 ›› 2005, Vol. 25 ›› Issue (02): 437-439.DOI: 10.3724/SP.J.1087.2005.0437

• 典型应用 • 上一篇    下一篇

基于COM的芯片仿真技术研究

唐明董1,雷电2   

  1. 1.湖南科技大学计算机科学与工程学院; 2.上海大学自动化系
  • 发布日期:2005-02-01 出版日期:2005-02-01

Research of chip simulation based on COM

TANG Ming-dong1,LEI Dian2   

  1. 1.Department of Computer Science, Hunan University of Science and Technology, Xiangtan Hunan 411201, China; 2. Department of Automation, Shanghai University, Shanghai 200072, China
  • Online:2005-02-01 Published:2005-02-01

摘要:  介绍了利用COM对象来模拟和仿真硬件芯片的结构、功能、特征以及信号的传递方式。针对芯片仿真,提出了一种软芯片模型,实现仿真模型的构件化,提高其重用性,对于系统仿真,构件化软件开发具有一定的应用价值。

关键词: 软芯片, COM, 仿真, 构件, 数据传递

Abstract: Using COM as an object to simulate the structure, function, character and signal transfer of chips was introduced. According to chip simulation, the concept of software chip was presented, which can be used to make simulation model component-based and improve its reusability, thus it has some value in application for system simulation and component-based software design.

Key words: software chip, COM, simulation, component, data transfer

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