基于三维线性反馈移位寄存器的三维堆叠集成电路可重构测试方案
陈田, 鲁建勇, 刘军, 梁华国, 鲁迎春
Reconfigurable test scheme for 3D stacked integrated circuits based on 3D linear feedback shift register
Tian CHEN, Jianyong LU, Jun LIU, Huaguo LIANG, Yingchun LU
《计算机应用》唯一官方网站
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2023, (3): 949
-955
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DOI: 10.11772/j.issn.1001-9081.2022020186
