Abstract: According to the Moore's law, it becomes more and more complex to design high-speed and high-density Printed Circuit Board (PCB). As to Signal Integrity (SI) of large or extra large high-speed and high-density PCB, a research method combing theory analysis and mode simulation with project practice was introduced; meanwhile, some solutions or design rules were put forward. Following issues were discussed: PCB stack-up, the styles of transmission line, characteristic impedance calculation, topology, terminations, delay matching, crosstalk, differential pair layout, etc. On this basis, a few of principles were given about multilayers PCB design based on Field Programmable Gate Array (FPGA). Specific project application proves that high-speed and high-density PCB design can get good practical results driven by these principles or mechanisms.

Key words: Printed Circuit Board (PCB), Signal Integrity (SI), impedance control, Low Voltage Differential Signal(LVDS), Field Programmable Gate Array (FPGA)

摘要： 根据摩尔定律，高速高密度印刷电路板(PCB)的设计变得越来越复杂。针对大型或特大型高速高密度PCB设计中信号完整性的一些关键问题，如：PCB层叠、传输线类型、特征阻抗计算、互连拓扑结构、端接技术、延迟匹配、串扰分析、差分布线等，通过理论分析、仿真验证、工程实践相结合的方式进行讨论，并给出相应的解决方法或设计规则。在此基础上，给出现场可编程门阵列(FPGA)多层PCB板设计原则。具体工程实验证明，在这些规则或机制的驱动下，高速高密度PCB的设计能够获得良好的实际效果。

关键词: 印刷电路板, 信号完整性, 阻抗控制, 差分线, 现场可编程门阵列