关键词: 印刷电路板, 信号完整性, 阻抗控制, 差分线, 现场可编程门阵列

Abstract: According to the Moore's law, it becomes more and more complex to design high-speed and high-density Printed Circuit Board (PCB). As to Signal Integrity (SI) of large or extra large high-speed and high-density PCB, a research method combing theory analysis and mode simulation with project practice was introduced; meanwhile, some solutions or design rules were put forward. Following issues were discussed: PCB stack-up, the styles of transmission line, characteristic impedance calculation, topology, terminations, delay matching, crosstalk, differential pair layout, etc. On this basis, a few of principles were given about multilayers PCB design based on Field Programmable Gate Array (FPGA). Specific project application proves that high-speed and high-density PCB design can get good practical results driven by these principles or mechanisms.

Key words: Printed Circuit Board (PCB), Signal Integrity (SI), impedance control, Low Voltage Differential Signal(LVDS), Field Programmable Gate Array (FPGA)