[1] 薛明阳,卫国强,金亮,等.不同应变速率下BGA焊球剪切断裂实验与模拟分析[J].焊接学报,2014,35(3):45-48.(XUE M Y, WEI G Q, JIN L, et al. Shear fracture test and simulation analysis of BGA welding balls at different strain rates[J]. Transactions of the China Welding Institution, 2014, 35(3):45-48.)
[2] 桂晟偲,刘佳.BGA空洞控制的回归分析研究[J].电子工艺技术,2011,32(3):148-151.(GUI S C, LIU J. Study on regression analysis for BGA void control[J]. Electronic Process Technology, 2011, 32(3):148-151.)
[3] 方园,符永高,王玲,等.微电子封装无铅焊点的可靠性研究进展及评述[J].电子工艺技术,2010,31(2):72-76.(FANG Y, FU Y G, WANG L, et al. Progress and review on lead-free solder joint reliability in micro-electronic packaging[J]. Electronic Process Technology, 2010, 31(2):72-76.)
[4] 李乐.基于精密微焦点X射线的BGA焊点缺陷检测关键技术研究[D].广州:华南理工大学,2014:39-40.(LI L. Research on key technologies of BGA solder joint defect detection based on precision micro-focus X-ray[D]. Guangzhou:South China University of Technology, 2014:39-40.)
[5] 王树清,文大化.混装条件下BGA焊点空洞问题[J].电子工艺技术,2012,33(5):289-291.(WANG S Q, WEN D H. BGA solder joint void problem under mixed loading[J]. Electronic Process Technology, 2012, 33(5):289-291.)
[6] SA-NGUANNAM A, SRINONCHAT J. Analysis ball grid array defects by using new image technique[C]//Proceedings of the 9th International Conference on Signal Processing. Piscataway, NJ:IEEE, 2008:785-788.
[7] 夏石川,桂志国,张权,等.基于偏微分方程的BGA射线图像去噪方法[J].中北大学学报(自然科学版),2013, 34(6):667-672.(XIA S C, GUI Z G, ZHANG Q, et al. Denoising methods based on partial differential equation for BGA X-ray image[J]. Journal of North University of China (Natural Science Edition), 2013, 34(6):667-672.)
[8] PENG S H, NAM H D. BGA void detection in X-ray images based on a new blob detector[C]//Proceedings of the 4th International Congress on Image and Signal Processing. Piscataway, NJ:IEEE, 2011:1847-1850.
[9] SUMIMOTO T, MARUYAMA T, AZUMA Y, et al. Development of image analysis for detection of defects of BGA by using X-ray images[C]//Proceedings of the 20th IEEE Instrumentation Technology Conference. Piscataway, NJ:IEEE, 2003:1131-1136.
[10] SAID A F, BENNETT B L, KARAM L J, et al. Robust automatic void detection in solder balls[C]//Proceedings of the 2010 IEEE International Conference on Acoustics, Speech and Signal Processing. Piscataway, NJ:IEEE, 2010:1650-1653.
[11] 张俊生,王明泉,郭晋秦,等.球栅阵列焊点空洞缺陷的数学形态学分析[J].科学技术与工程,2018,18(2):296-299.(ZHANG J S, WANG M Q, GUO J Q, et al. Analysis of void defects in BGA solder joints with mathematical morphology[J]. Science Technology and Engineering, 2018,18(2):296-299.)
[12] SHELHAMER E, LONG J, DARRELL T. Fully convolutional networks for semantic segmentation[J]. IEEE Transactions on Pattern Analysis and Machine Intelligence, 2017, 39(4):640-651.
[13] 魏杰.基于K-means聚类算法改进算法的研究[J].信息通信,2018(5):14-15.(WEI J. Research on improved algorithm based on K-means clustering algorithm[J]. Information and Communication, 2018(5):14-15.)
[14] 刘一鸣,张鹏程,刘祎,等.基于全卷积网络和条件随机场的宫颈癌细胞学图像的细胞核分割[J].计算机应用,2018,38(11):3348-3354.(LIU Y M, ZHANG P C, LIU Y, et al. Segmentation of cervical nuclei based on fully convolutional network and conditional random field[J]. Journal of Computer Applications, 2018,38(11):3348-3354.)
[15] SIMONYAN K,ZISSERMAN A. Very deep convolutional networks for large-scale image recognition[EB/OL].[2018-11-20]. https://arxiv.org/pdf/1409.1556.pdf.
[16] 胡明辉,李俊,申妍燕,等.基于深度神经网络的尺桡骨远端图像语义分割[J].图像与信号处理,2018,7(2):85-95.(HU M H, LI J, SHEN Y Y, et al. DRU image semantic segmentation using deep neural networks[J]. Journal of Image and Signal Processing, 2018, 7(2):85-95.)
[17] 张俊生,王明泉,郭晋秦,等.BGA焊点气泡缺陷X射线图像的动态阈值分割方法[J].火力与指挥控制,2018,43(10):113-116.(ZHANG J S, WANG M Q, GUO J Q, et al. Dynamic threshold segmentation method for X-ray images of bubble defects in BGA solder joints[J]. Fire Control and Command Control, 2018, 43(10):113-116.)
[18] 张鹏程.基于平板探测器的BGA缺陷检测技术[D].太原:中北大学,2009:34-48.(ZHANG P C. BGA defect detection technology based on flat panel detector[D]. Taiyuan:North University of China, 2009:34-48.) |